Xilinx - XC3S5000-5FG900I

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XC3S5000-5FG900I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC3S5000-5FG900I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN LEAD;
Datasheet XC3S5000-5FG900I Datasheet
In Stock327
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Programmable IC Type: FPGA
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of Inputs: 633
Technology Used: CMOS
Sub-Category: Field Programmable Gate Arrays
No. of Logic Cells: 74880
Surface Mount: Yes
JESD-609 Code: e0
No. of Outputs: 633
Position Of Terminal: Bottom
No. of Terminals: 900
Qualification: No
Package Equivalence Code: BGA900,30X30,40
Finishing Of Terminal Used: Tin Lead
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B900
Form Of Terminal: Ball
Package Shape: Square
Pitch Of Terminal: 1 mm
Package Code: BGA
Peak Reflow Temperature (C): 225 °C (437 °F)
Moisture Sensitivity Level (MSL): 3
Power Supplies (V): 1.2,1.2/3.3,2.5 V
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Pricing (USD)

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