Xilinx - XC3S50AN-4FT256C

XC3S50AN-4FT256C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC3S50AN-4FT256C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
Datasheet XC3S50AN-4FT256C Datasheet
In Stock1,570
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 176 CLBS, 50000 Gates
Maximum Combinatorial Delay of a CLB: 0.71 ns
Maximum Seated Height: 1.55 mm
No. of Inputs: 144
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 112
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 50000
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 667 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: LBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 1584
No. of CLBs: 176
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Length: 17 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Power Supplies (V): 1.2,1.2/3.3,3.3 V
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