Xilinx - XC3S700AN-4FG676C

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XC3S700AN-4FG676C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC3S700AN-4FG676C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC3S700AN-4FG676C Datasheet
In Stock223
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 1472 CLBS, 700000 Gates
Maximum Combinatorial Delay of a CLB: 4.88 ns
Maximum Seated Height: 2.6 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 676
No. of Equivalent Gates: 700000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B676
Maximum Clock Frequency: 667 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of CLBs: 1472
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin Lead
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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