Xilinx - XC3SD1800A-5FG676C

XC3SD1800A-5FG676C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC3SD1800A-5FG676C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC3SD1800A-5FG676C Datasheet
In Stock452
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 4160 CLBS, 1800000 Gates
Maximum Combinatorial Delay of a CLB: 0.62 ns
Maximum Seated Height: 2.6 mm
No. of Inputs: 519
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 409
Position Of Terminal: Bottom
No. of Terminals: 676
No. of Equivalent Gates: 1800000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B676
Maximum Clock Frequency: 280 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial Extended
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 37440
No. of CLBs: 4160
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA676,26X26,40
Finishing Of Terminal Used: Tin Lead
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Power Supplies (V): 1.2,2.5/3.3 V
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