Xilinx - XC4013D-6BG225C

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XC4013D-6BG225C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC4013D-6BG225C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC4013D-6BG225C Datasheet
In Stock477
NAME DESCRIPTION
Minimum Supply Voltage: 4.75 V
Package Body Material: Plastic/Epoxy
Organization: 576 CLBS, 10000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 6 ns
Maximum Seated Height: 2.165 mm
No. of Inputs: 192
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 192
Position Of Terminal: Bottom
No. of Terminals: 225
No. of Equivalent Gates: 10000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B225
Maximum Clock Frequency: 90.9 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 5.25 V
Nominal Supply Voltage (V): 5
Technology Used: CMOS
No. of Logic Cells: 1368
No. of CLBs: 576
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA225,15X15
Finishing Of Terminal Used: Tin Lead
Length: 27 mm
Form Of Terminal: Ball
Additional Features: 1536 flip-flops; typical gates = 10000-13000
Pitch Of Terminal: 1.5 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 5 V
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