Xilinx - XC4013XL-3BG225C

XC4013XL-3BG225C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC4013XL-3BG225C
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
Datasheet XC4013XL-3BG225C Datasheet
In Stock84
NAME DESCRIPTION
Package Body Material: Ceramic
Programmable IC Type: FPGA
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of Inputs: 192
Nominal Supply Voltage (V): 5
Sub-Category: Field Programmable Gate Arrays
No. of Logic Cells: 1368
Surface Mount: Yes
JESD-609 Code: e0
No. of Outputs: 192
Position Of Terminal: Bottom
No. of Terminals: 225
Qualification: No
Package Equivalence Code: BGA225,15X15
Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)
Package Style (Meter): Grid Array
JESD-30 Code: S-XBGA-B225
Form Of Terminal: Ball
Package Shape: Square
Pitch Of Terminal: 1.5 mm
Package Code: BGA
Peak Reflow Temperature (C): 225 °C (437 °F)
Moisture Sensitivity Level (MSL): 3
Power Supplies (V): 5 V
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