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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC4013XL-3BG225C |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; |
Datasheet | XC4013XL-3BG225C Datasheet |
In Stock | 84 |
NAME | DESCRIPTION |
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Package Body Material: | Ceramic |
Programmable IC Type: | FPGA |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
No. of Inputs: | 192 |
Nominal Supply Voltage (V): | 5 |
Sub-Category: | Field Programmable Gate Arrays |
No. of Logic Cells: | 1368 |
Surface Mount: | Yes |
JESD-609 Code: | e0 |
No. of Outputs: | 192 |
Position Of Terminal: | Bottom |
No. of Terminals: | 225 |
Qualification: | No |
Package Equivalence Code: | BGA225,15X15 |
Finishing Of Terminal Used: | Tin/Lead (Sn63Pb37) |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-XBGA-B225 |
Form Of Terminal: | Ball |
Package Shape: | Square |
Pitch Of Terminal: | 1.5 mm |
Package Code: | BGA |
Peak Reflow Temperature (C): | 225 °C (437 °F) |
Moisture Sensitivity Level (MSL): | 3 |
Power Supplies (V): | 5 V |