Xilinx - XC40200XV-09BG560I

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XC40200XV-09BG560I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC40200XV-09BG560I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
Datasheet XC40200XV-09BG560I Datasheet
In Stock102
NAME DESCRIPTION
Minimum Supply Voltage: 2.3 V
Package Body Material: Plastic/Epoxy
Organization: 7056 CLBS, 130000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 1.3 ns
Maximum Seated Height: 1.7 mm
No. of Inputs: 448
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 448
Position Of Terminal: Bottom
No. of Terminals: 560
No. of Equivalent Gates: 130000
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B560
Maximum Clock Frequency: 225 MHz
Package Shape: Square
Package Code: LBGA
Width: 42.5 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 2.7 V
Nominal Supply Voltage (V): 2.5
Technology Used: CMOS
No. of Logic Cells: 7056
No. of CLBs: 7056
JESD-609 Code: e0
Qualification: No
Package Equivalence Code: BGA560,33X33,50
Finishing Of Terminal Used: Tin Lead
Length: 42.5 mm
Form Of Terminal: Ball
Additional Features: Can also use 400000 gates
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 2.5,3.3 V
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