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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC4020XL-1BGG256I |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250; |
| Datasheet | XC4020XL-1BGG256I Datasheet |
| In Stock | 154 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 3 V |
| Package Body Material: | Plastic/Epoxy |
| Organization: | 784 CLBS, 13000 Gates |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| Maximum Combinatorial Delay of a CLB: | 1.3 ns |
| Maximum Seated Height: | 2.55 mm |
| Surface Mount: | Yes |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 256 |
| No. of Equivalent Gates: | 13000 |
| Package Style (Meter): | Grid Array |
| JESD-30 Code: | S-PBGA-B256 |
| Maximum Clock Frequency: | 200 MHz |
| Package Shape: | Square |
| Package Code: | BGA |
| Width: | 27 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 3.6 V |
| Nominal Supply Voltage (V): | 3.3 |
| Technology Used: | CMOS |
| No. of CLBs: | 784 |
| JESD-609 Code: | e1 |
| Qualification: | No |
| Finishing Of Terminal Used: | Tin Silver Copper |
| Length: | 27 mm |
| Form Of Terminal: | Ball |
| Additional Features: | Max usable 20000 Logic gates |
| Pitch Of Terminal: | 1.27 mm |
| Peak Reflow Temperature (C): | 250 °C (482 °F) |









