Xilinx - XC4VFX12-11SFG363C

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XC4VFX12-11SFG363C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC4VFX12-11SFG363C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;
Datasheet XC4VFX12-11SFG363C Datasheet
In Stock1,030
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 1368 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.99 mm
No. of Inputs: 240
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 240
Position Of Terminal: Bottom
No. of Terminals: 363
Package Style (Meter): Grid Array, Fine Pitch
JESD-30 Code: S-PBGA-B363
Maximum Clock Frequency: 1181 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: FBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 12312
No. of CLBs: 1368
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA363,20X20,32
Finishing Of Terminal Used: Tin Silver Copper
Length: 17 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
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