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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC4VFX60-11FF672CS1 |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 220; |
Datasheet | XC4VFX60-11FF672CS1 Datasheet |
In Stock | 497 |
NAME | DESCRIPTION |
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Package Body Material: | Plastic/Epoxy |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
No. of Inputs: | 352 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 352 |
Position Of Terminal: | Bottom |
No. of Terminals: | 672 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B672 |
Maximum Clock Frequency: | 1181 MHz |
Package Shape: | Square |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 4 |
Programmable IC Type: | FPGA |
Technology Used: | CMOS |
No. of Logic Cells: | 56880 |
JESD-609 Code: | e0 |
Qualification: | No |
Package Equivalence Code: | BGA672,26X26,40 |
Finishing Of Terminal Used: | Tin/Lead (Sn63Pb37) |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 220 °C (428 °F) |
Power Supplies (V): | 1.2,1.2/3.3,2.5 V |