Xilinx - XC4VLX15-11SFG363CS2

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XC4VLX15-11SFG363CS2 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC4VLX15-11SFG363CS2
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Datasheet XC4VLX15-11SFG363CS2 Datasheet
In Stock385
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of Inputs: 240
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 240
Position Of Terminal: Bottom
No. of Terminals: 363
Package Style (Meter): Grid Array, Fine Pitch
JESD-30 Code: S-PBGA-B363
Maximum Clock Frequency: 1205 MHz
Package Shape: Square
Package Code: FBGA
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA
Technology Used: CMOS
No. of Logic Cells: 13824
JESD-609 Code: e1
Qualification: No
Package Equivalence Code: BGA363,20X20,32
Finishing Of Terminal Used: Tin Silver Copper
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2,1.2/3.3,2.5 V
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