Xilinx - XC5215L-4BGG225C

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XC5215L-4BGG225C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC5215L-4BGG225C
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Datasheet XC5215L-4BGG225C Datasheet
In Stock163
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: Plastic/Epoxy
Organization: 484 CLBS, 15000 Gates
Maximum Seated Height: 3.5 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 225
No. of Equivalent Gates: 15000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B225
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 3.6 V
Nominal Supply Voltage (V): 3.3
Technology Used: CMOS
No. of CLBs: 484
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Length: 27 mm
Form Of Terminal: Ball
Additional Features: Typical gates = 15000-23000
Pitch Of Terminal: 1.5 mm
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