Xilinx - XC6SLX25T-4CSG324C

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XC6SLX25T-4CSG324C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC6SLX25T-4CSG324C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet XC6SLX25T-4CSG324C Datasheet
In Stock1,466
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.5 mm
No. of Inputs: 190
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 190
Position Of Terminal: Bottom
No. of Terminals: 324
Package Style (Meter): Grid Array, Low Profile, Fine Pitch
JESD-30 Code: S-PBGA-B324
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: LFBGA
Width: 15 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Technology Used: CMOS
No. of Logic Cells: 24051
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA324,18X18,32
Finishing Of Terminal Used: Tin Silver Copper
Length: 15 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2,2.5/3.3 V
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