Xilinx - XC6SLX75T-4CSG484C

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XC6SLX75T-4CSG484C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC6SLX75T-4CSG484C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;
Datasheet XC6SLX75T-4CSG484C Datasheet
In Stock1,374
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.8 mm
No. of Inputs: 292
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 292
Position Of Terminal: Bottom
No. of Terminals: 484
Package Style (Meter): Grid Array, Fine Pitch
JESD-30 Code: S-PBGA-B484
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: FBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Technology Used: CMOS
No. of Logic Cells: 74637
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA484,22X22,32
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 19 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2,2.5/3.3 V
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