Xilinx - XC7A100T-L2FFG1156I

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XC7A100T-L2FFG1156I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7A100T-L2FFG1156I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC7A100T-L2FFG1156I Datasheet
In Stock136
NAME DESCRIPTION
Minimum Supply Voltage: .87 V
Package Body Material: Plastic/Epoxy
Organization: 7925 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 1.51 ns
Maximum Seated Height: 3.1 mm
No. of Inputs: 300
Surface Mount: Yes
No. of Outputs: 300
Position Of Terminal: Bottom
No. of Terminals: 1156
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1156
Maximum Clock Frequency: 1098 MHz
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: .93 V
Nominal Supply Voltage (V): 0.9
No. of Logic Cells: 101440
No. of CLBs: 7925
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA1156,34X34,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 35 mm
Form Of Terminal: Ball
Additional Features: Also Operates at 1 V nominal supply
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
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