Xilinx - XC7A200T-3FFG1156E

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XC7A200T-3FFG1156E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7A200T-3FFG1156E
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC7A200T-3FFG1156E Datasheet
In Stock1
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: Plastic/Epoxy
Organization: 16825 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.94 ns
Maximum Seated Height: 3.1 mm
No. of Inputs: 500
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 500
Position Of Terminal: Bottom
No. of Terminals: 1156
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1156
Maximum Clock Frequency: 1412 MHz
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
No. of Logic Cells: 215360
No. of CLBs: 16825
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA1156,34X34,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
Power Supplies (V): 1 V
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