Xilinx - XC7A25T-2CSG325C

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XC7A25T-2CSG325C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7A25T-2CSG325C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet XC7A25T-2CSG325C Datasheet
In Stock6
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: Plastic/Epoxy
Organization: 1825 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 1.05 ns
Maximum Seated Height: 1.5 mm
No. of Inputs: 150
Surface Mount: Yes
No. of Outputs: 150
Position Of Terminal: Bottom
No. of Terminals: 325
Package Style (Meter): Grid Array, Low Profile, Fine Pitch
JESD-30 Code: S-PBGA-B325
Maximum Clock Frequency: 1286 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: LFBGA
Width: 15 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
Technology Used: HKMG
No. of Logic Cells: 23360
No. of CLBs: 1825
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: BGA325,18X18,32
Finishing Of Terminal Used: Tin Silver Copper
Length: 15 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
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