Xilinx - XC7A35T-L1CSG325I

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XC7A35T-L1CSG325I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7A35T-L1CSG325I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet XC7A35T-L1CSG325I Datasheet
In Stock130
NAME DESCRIPTION
Minimum Supply Voltage: .92 V
Package Body Material: Plastic/Epoxy
Organization: 2600 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 1.27 ns
Maximum Seated Height: 1.5 mm
No. of Inputs: 250
Surface Mount: Yes
No. of Outputs: 250
Position Of Terminal: Bottom
No. of Terminals: 325
Package Style (Meter): Grid Array, Low Profile, Fine Pitch
JESD-30 Code: S-PBGA-B325
Maximum Clock Frequency: 1098 MHz
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: LFBGA
Width: 15 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: .98 V
Nominal Supply Voltage (V): 0.95
No. of Logic Cells: 33280
No. of CLBs: 2600
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA325,18X18,32
Finishing Of Terminal Used: Tin Silver Copper
Length: 15 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
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