Xilinx - XC7A50T-2FTG256C

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XC7A50T-2FTG256C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7A50T-2FTG256C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet XC7A50T-2FTG256C Datasheet
In Stock4
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: Plastic/Epoxy
Organization: 4075 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 1.05 ns
Maximum Seated Height: 1.55 mm
No. of Inputs: 250
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 250
Position Of Terminal: Bottom
No. of Terminals: 256
Package Style (Meter): Grid Array, Low Profile, Fine Pitch
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 1286 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: LFBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
No. of Logic Cells: 52160
No. of CLBs: 4075
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 17 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1 V
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