Xilinx - XC7K325T-1LFBG900C

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XC7K325T-1LFBG900C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7K325T-1LFBG900C
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Surface Mount: YES; Peak Reflow Temperature (C): 245; Qualification: Not Qualified;
Datasheet XC7K325T-1LFBG900C Datasheet
In Stock455
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Programmable IC Type: FPGA
Maximum Time At Peak Reflow Temperature (s): 30 s
Surface Mount: Yes
JESD-609 Code: e1
Position Of Terminal: Bottom
No. of Terminals: 900
Qualification: No
Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Package Style (Meter): Grid Array
Form Of Terminal: Ball
Peak Reflow Temperature (C): 245 °C (473 °F)
Moisture Sensitivity Level (MSL): 4
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