Xilinx - XC7K325T-1LFBG900E

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XC7K325T-1LFBG900E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7K325T-1LFBG900E
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Peak Reflow Temperature (C): 245; Package Body Material: PLASTIC/EPOXY; Finishing Of Terminal Used: TIN SILVER COPPER;
Datasheet XC7K325T-1LFBG900E Datasheet
In Stock1,218
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Programmable IC Type: FPGA
Maximum Time At Peak Reflow Temperature (s): 30 s
Surface Mount: Yes
JESD-609 Code: e1
Position Of Terminal: Bottom
No. of Terminals: 900
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Package Style (Meter): Grid Array
Form Of Terminal: Ball
Peak Reflow Temperature (C): 245 °C (473 °F)
Moisture Sensitivity Level (MSL): 4
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