Xilinx - XC7K325T-2FFG900C

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XC7K325T-2FFG900C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7K325T-2FFG900C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC7K325T-2FFG900C Datasheet
In Stock9
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: Plastic/Epoxy
Organization: 25475 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.61 ns
Maximum Seated Height: 3.35 mm
No. of Inputs: 500
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 500
Position Of Terminal: Bottom
No. of Terminals: 900
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B900
Maximum Clock Frequency: 1818 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.03 V
Nominal Supply Voltage (V): 1
Technology Used: CMOS
No. of Logic Cells: 326080
No. of CLBs: 25475
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA900,30X30,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 31 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
Power Supplies (V): 1,1.8,3.3 V
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