Xilinx - XC7K410T-L2FFG900E

XC7K410T-L2FFG900E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7K410T-L2FFG900E
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
Datasheet XC7K410T-L2FFG900E Datasheet
In Stock1
NAME DESCRIPTION
Minimum Supply Voltage: .87 V
Package Body Material: Plastic/Epoxy
Organization: 31775 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.91 ns
Maximum Seated Height: 3.35 mm
No. of Inputs: 500
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 500
Position Of Terminal: Bottom
No. of Terminals: 900
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B900
Package Shape: Square
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA
Maximum Supply Voltage: .93 V
Nominal Supply Voltage (V): .9
Technology Used: CMOS
No. of Logic Cells: 406720
No. of CLBs: 31775
JESD-609 Code: e1
Qualification: No
Package Equivalence Code: BGA900,30X30,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 31 mm
Form Of Terminal: Ball
Additional Features: Also Operates at 1 V supply
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
Power Supplies (V): 0.9,1.8,3.3 V
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