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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC7V2000T-1FFG1761E |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 1761; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | XC7V2000T-1FFG1761E Datasheet |
| In Stock | 1,133 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .97 V |
| Package Body Material: | Plastic/Epoxy |
| Organization: | 305400 CLBS |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| Surface Mount: | Yes |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 1761 |
| Package Style (Meter): | Grid Array |
| JESD-30 Code: | S-PBGA-B1761 |
| Package Shape: | Square |
| Maximum Operating Temperature: | 125 °C (257 °F) |
| Package Code: | BGA |
| Width: | 42.5 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Grading Of Temperature: | Military |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 1.03 V |
| Nominal Supply Voltage (V): | 1 |
| No. of CLBs: | 305400 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -55 °C (-67 °F) |
| Qualification: | No |
| Finishing Of Terminal Used: | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Length: | 42.5 mm |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | 1 mm |
| Peak Reflow Temperature (C): | 245 °C (473 °F) |









