Xilinx - XC7V585T-3FFG784E

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XC7V585T-3FFG784E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7V585T-3FFG784E
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC7V585T-3FFG784E Datasheet
In Stock496
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Grading Of Temperature: Military
Organization: 91050 CLBS
Programmable IC Type: FPGA
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of CLBs: 91050
Surface Mount: Yes
JESD-609 Code: e1
Minimum Operating Temperature: -55 °C (-67 °F)
Position Of Terminal: Bottom
No. of Terminals: 784
Qualification: No
Finishing Of Terminal Used: Tin/Silver/Copper
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B784
Form Of Terminal: Ball
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Peak Reflow Temperature (C): 245 °C (473 °F)
Moisture Sensitivity Level (MSL): 4
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