Xilinx - XC7VX550T-3FFG1927I

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XC7VX550T-3FFG1927I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7VX550T-3FFG1927I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1927; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC7VX550T-3FFG1927I Datasheet
In Stock1,291
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: Plastic/Epoxy
Organization: 43300 CLBS
Maximum Combinatorial Delay of a CLB: 0.58 ns
Maximum Seated Height: 3.75 mm
No. of Inputs: 600
Surface Mount: Yes
No. of Outputs: 600
Position Of Terminal: Bottom
No. of Terminals: 1927
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1927
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 45 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.03 V
Nominal Supply Voltage (V): 1
Technology Used: HKMG
No. of Logic Cells: 554240
No. of CLBs: 43300
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA1927,44X44,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 45 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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