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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC7Z030-1FBG676C |
Description | SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V; |
Datasheet | XC7Z030-1FBG676C Datasheet |
In Stock | 81 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .95 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | SYSTEM ON CHIP |
Nominal Supply Voltage: | 1 V |
Maximum Supply Voltage: | 1.05 V |
Maximum Seated Height: | 2.54 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | 0 Cel |
No. of Terminals: | 676 |
Package Equivalence Code: | BGA676,26X26,40 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Length: | 27 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B676 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Width: | 27 mm |
Terminal Pitch: | 1 mm |