XC7Z035-2FFG676I by Xilinx | Peripheral ICs

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Manufacturer	Xilinx
Manufacturer's Part Number	XC7Z035-2FFG676I
Description	SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Length: 27 mm;
Datasheet	XC7Z035-2FFG676I Datasheet
In Stock	1,020

NAME	DESCRIPTION
Minimum Supply Voltage:	.95 V
Package Body Material:	PLASTIC/EPOXY
Peripheral IC Type:	SYSTEM ON CHIP
Nominal Supply Voltage:	1 V
Maximum Supply Voltage:	1.05 V
Maximum Seated Height:	3.24 mm
Surface Mount:	YES
Minimum Operating Temperature:	-40 Cel
No. of Terminals:	676
Package Equivalence Code:	BGA676,26X26,40
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Length:	27 mm
Technology:	CMOS
JESD-30 Code:	S-PBGA-B676
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	100 Cel
Package Code:	BGA
Width:	27 mm
Terminal Pitch:	1 mm

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,020	-	-

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