Xilinx - XC7Z035-L1FBG676I

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XC7Z035-L1FBG676I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7Z035-L1FBG676I
Description FPGA SOC; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
Datasheet XC7Z035-L1FBG676I Datasheet
In Stock151
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: Plastic/Epoxy
Organization: 21487 CLBS, 4100000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 1.27 ns
Maximum Seated Height: 2.54 mm
No. of Inputs: 380
Surface Mount: Yes
No. of Outputs: 380
Position Of Terminal: Bottom
No. of Terminals: 676
No. of Equivalent Gates: 4100000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B676
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA SOC
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
No. of Logic Cells: 275000
No. of CLBs: 21487
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA676,26X26,40
Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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