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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC7Z100-2FFG900E |
| Description | SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V; |
| Datasheet | XC7Z100-2FFG900E Datasheet |
| In Stock | 185 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .95 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SYSTEM ON CHIP |
| Nominal Supply Voltage: | 1 V |
| Maximum Supply Voltage: | 1.05 V |
| Maximum Seated Height: | 3.24 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 900 |
| Package Equivalence Code: | BGA900,30X30,40 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Length: | 27 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B900 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 100 Cel |
| Package Code: | BGA |
| Width: | 27 mm |
| Terminal Pitch: | 1 mm |









