Xilinx - XC95216-10BGG352C

XC95216-10BGG352C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC95216-10BGG352C
Description FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;
Datasheet XC95216-10BGG352C Datasheet
In Stock167
NAME DESCRIPTION
Minimum Supply Voltage: 4.75 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 10 ns
Organization: 0 Dedicated Inputs, 166 I/O
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.4 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 352
No. of I/O Lines: 166
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B352
Maximum Clock Frequency: 66.7 MHz
Package Shape: Square
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: LBGA
Width: 35 mm
No. of Dedicated Inputs: 0
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial
Programmable IC Type: Flash PLD
Maximum Supply Voltage: 5.25 V
Nominal Supply Voltage (V): 5
Technology Used: CMOS
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 35 mm
Form Of Terminal: Ball
Additional Features: 216 Macrocells; Configurable I/O operation with 3.3 V or 5 V
Output Function: Macrocell
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
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