Xilinx - XCAU10P-L1FFVB676I

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XCAU10P-L1FFVB676I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCAU10P-L1FFVB676I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 5500;
Datasheet XCAU10P-L1FFVB676I Datasheet
In Stock833
NAME DESCRIPTION
Minimum Supply Voltage: .698 V
Package Body Material: Plastic/Epoxy
Organization: 5500 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 3.52 mm
No. of Inputs: 228
Surface Mount: Yes
No. of Outputs: 228
Position Of Terminal: Bottom
No. of Terminals: 676
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B676
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA
Maximum Supply Voltage: .742 V
Nominal Supply Voltage (V): 0.72
No. of Logic Cells: 96250
No. of CLBs: 5500
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA676,26X26,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 27 mm
Form Of Terminal: Ball
Additional Features: Also Operates at 0.85 V nominal supply
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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