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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCCACEM16BG388I |
| Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Parallel or Serial: SERIAL; |
| Datasheet | XCCACEM16BG388I Datasheet |
| In Stock | 465 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 1MX16 |
| Maximum Seated Height: | 2.87 mm |
| Minimum Supply Voltage (Vsup): | 1.71 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 240 mA |
| No. of Terminals: | 388 |
| No. of Words: | 1048576 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B388 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 1000000 Write/Erase Cycles |
| Package Code: | BGA |
| Width: | 35 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Memory Density: | 16777216 bit |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 16 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA388,26X26,50 |
| Length: | 35 mm |
| No. of Words Code: | 1M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Minimum Data Retention Time: | 20 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 1.89 V |
| Power Supplies (V): | 1.8,3.3 |
