Xilinx - XCE7V585T-L2FFG1157E

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XCE7V585T-L2FFG1157E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCE7V585T-L2FFG1157E
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;
Datasheet XCE7V585T-L2FFG1157E Datasheet
In Stock250
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: Plastic/Epoxy
Organization: 45525 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.61 ns
Maximum Seated Height: 3.35 mm
No. of Inputs: 600
Surface Mount: Yes
No. of Outputs: 600
Position Of Terminal: Bottom
No. of Terminals: 1157
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1157
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.03 V
Nominal Supply Voltage (V): 1
Technology Used: HKMG
No. of Logic Cells: 582720
No. of CLBs: 45525
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Finishing Of Terminal Used: Tin Silver Copper
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
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