Xilinx - XCE7VX415T-1FFG1927C

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XCE7VX415T-1FFG1927C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCE7VX415T-1FFG1927C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1927; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCE7VX415T-1FFG1927C Datasheet
In Stock480
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: Plastic/Epoxy
Organization: 32200 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.74 ns
Maximum Seated Height: 3.65 mm
No. of Inputs: 600
Surface Mount: Yes
No. of Outputs: 600
Position Of Terminal: Bottom
No. of Terminals: 1927
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1927
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 45 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.03 V
Nominal Supply Voltage (V): 1
Technology Used: HKMG
No. of Logic Cells: 412160
No. of CLBs: 32200
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Finishing Of Terminal Used: Tin/Silver/Copper
Length: 45 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
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