Xilinx - XCF02SVO20C0901

XCF02SVO20C0901 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCF02SVO20C0901
Description CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
Datasheet XCF02SVO20C0901 Datasheet
In Stock319
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 2MX1
Maximum Seated Height: 1.19 mm
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: YES
No. of Terminals: 20
No. of Words: 2097152 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G20
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Width: 4.4 mm
Memory Density: 2097152 bit
Memory IC Type: CONFIGURATION MEMORY
Minimum Operating Temperature: -40 Cel
Memory Width: 1
No. of Functions: 1
Qualification: Not Qualified
Length: 6.5024 mm
No. of Words Code: 2M
Nominal Supply Voltage / Vsup (V): 3.3
Parallel or Serial: SERIAL
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V
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Pricing (USD)

Qty. Unit Price Ext. Price
319 - -

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