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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCF04SVOG20C |
| Description | CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Width: 4.4 mm; Peak Reflow Temperature (C): 260; |
| Datasheet | XCF04SVOG20C Datasheet |
| In Stock | 151 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .01 Amp |
| Organization: | 4MX1 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.19 mm |
| Programming Voltage (V): | 3.3 |
| Minimum Supply Voltage (Vsup): | 3 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 10 mA |
| Terminal Finish: | Matte Tin (Sn) |
| No. of Terminals: | 20 |
| Maximum Clock Frequency (fCLK): | 33 MHz |
| No. of Words: | 4194304 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Write Protection: | HARDWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G20 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 20000 Write/Erase Cycles |
| Package Code: | TSSOP |
| Width: | 4.4 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 4194304 bit |
| Memory IC Type: | CONFIGURATION MEMORY |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 1 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP20,.25 |
| Length: | 6.5024 mm |
| No. of Words Code: | 4M |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Minimum Data Retention Time: | 20 |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | .65 mm |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 1.8/3.3,3.3 |
