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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCF08PFSG48C |
| Description | CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 8388608 bit; |
| Datasheet | XCF08PFSG48C Datasheet |
| In Stock | 2,674 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .001 Amp |
| Organization: | 8MX1 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 1.65 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 40 mA |
| Terminal Finish: | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) |
| No. of Terminals: | 48 |
| Maximum Clock Frequency (fCLK): | 33 MHz |
| No. of Words: | 8388608 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B48 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 20000 Write/Erase Cycles |
| Package Code: | TFBGA |
| Width: | 8 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Other Names: |
122-1453 XCF08P-FSG48C |
| Memory Density: | 8388608 bit |
| Memory IC Type: | CONFIGURATION MEMORY |
| JESD-609 Code: | e2 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 1 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA48,6X8,32 |
| Length: | 9 mm |
| No. of Words Code: | 8M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Additional Features: | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 2 V |
| Power Supplies (V): | 1.5/3.3,1.8 |
