Xilinx - XCKU040-2FBVA900E

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XCKU040-2FBVA900E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCKU040-2FBVA900E
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCKU040-2FBVA900E Datasheet
In Stock2
NAME DESCRIPTION
Minimum Supply Voltage: .922 V
Package Body Material: Plastic/Epoxy
Organization: 1920 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 2.8 mm
No. of Inputs: 520
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 520
Position Of Terminal: Bottom
No. of Terminals: 900
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B900
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: .979 V
Nominal Supply Voltage (V): .95
No. of Logic Cells: 530250
No. of CLBs: 1920
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA900,30X30,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 31 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
Power Supplies (V): 0.95 V
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