Xilinx - XCKU095-1FFVB1760E

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XCKU095-1FFVB1760E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCKU095-1FFVB1760E
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCKU095-1FFVB1760E Datasheet
In Stock183
NAME DESCRIPTION
Minimum Supply Voltage: .922 V
Package Body Material: Plastic/Epoxy
Organization: 67200 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 3.71 mm
No. of Inputs: 702
Surface Mount: Yes
No. of Outputs: 702
Position Of Terminal: Bottom
No. of Terminals: 1760
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1760
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 42.5 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Commercial Extended
Programmable IC Type: FPGA
Maximum Supply Voltage: .979 V
Nominal Supply Voltage (V): 0.95
No. of Logic Cells: 1176000
No. of CLBs: 67200
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: BGA1760,42X42,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 42.5 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
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