Xilinx - XCKU3P-1SFVB784E

XCKU3P-1SFVB784E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCKU3P-1SFVB784E
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
Datasheet XCKU3P-1SFVB784E Datasheet
In Stock1,559
NAME DESCRIPTION
Minimum Supply Voltage: .825 V
Package Body Material: Plastic/Epoxy
Organization: 20340 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 3.32 mm
No. of Inputs: 304
Surface Mount: Yes
No. of Outputs: 304
Position Of Terminal: Bottom
No. of Terminals: 784
Package Style (Meter): Grid Array, Fine Pitch
JESD-30 Code: S-PBGA-B784
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: FBGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: .876 V
Nominal Supply Voltage (V): 0.85
No. of Logic Cells: 355950
No. of CLBs: 20340
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: BGA784,28X28,32
Finishing Of Terminal Used: Tin Silver Copper
Length: 23 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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