Xilinx - XCKU3P-L1FFVD900I

XCKU3P-L1FFVD900I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCKU3P-L1FFVD900I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCKU3P-L1FFVD900I Datasheet
In Stock1,112
NAME DESCRIPTION
Minimum Supply Voltage: .698 V
Package Body Material: Plastic/Epoxy
Organization: 20340 CLBS
Maximum Seated Height: 3.42 mm
No. of Inputs: 304
Surface Mount: Yes
No. of Outputs: 304
Position Of Terminal: Bottom
No. of Terminals: 900
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B900
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: .742 V
Nominal Supply Voltage (V): 0.72
No. of Logic Cells: 355950
No. of CLBs: 20340
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA900,30X30,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 31 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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