Xilinx - XCR3064XL-10CS48C

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XCR3064XL-10CS48C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCR3064XL-10CS48C
Description EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;
Datasheet XCR3064XL-10CS48C Datasheet
In Stock152
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 10 ns
Organization: 0 Dedicated Inputs, 40 I/O
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.8 mm
Sub-Category: Programmable Logic Devices
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 48
JTAG Boundary Scan Test: Yes
No. of I/O Lines: 40
Package Style (Meter): Grid Array, Fine Pitch
JESD-30 Code: S-PBGA-B48
Maximum Clock Frequency: 95 MHz
Package Shape: Square
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: FBGA
Width: 7 mm
No. of Dedicated Inputs: 0
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial
Programmable IC Type: EE PLD
Maximum Supply Voltage: 3.6 V
Nominal Supply Voltage (V): 3.3
Technology Used: CMOS
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA48,7X7,32
Finishing Of Terminal Used: Tin Lead
Length: 7 mm
Form Of Terminal: Ball
In-System Programmable: Yes
Output Function: Macrocell
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 240 °C (464 °F)
No. of Macro Cells: 64
Power Supplies (V): 3.3 V
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