Xilinx - XCR3256XL-7.5CSG280C

XCR3256XL-7.5CSG280C by Xilinx

Image shown is a representation only.

Manufacturer Xilinx
Manufacturer's Part Number XCR3256XL-7.5CSG280C
Description EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet XCR3256XL-7.5CSG280C Datasheet
In Stock172
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 7.5 ns
Organization: 160 I/O
Maximum Seated Height: 1.2 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 280
No. of I/O Lines: 160
Package Style (Meter): Grid Array, Thin Profile, Fine Pitch
JESD-30 Code: S-PBGA-B280
Maximum Clock Frequency: 167 MHz
Package Shape: Square
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: TFBGA
Width: 16 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial
Programmable IC Type: EE PLD
Maximum Supply Voltage: 3.6 V
Nominal Supply Voltage (V): 3.3
Technology Used: CMOS
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Length: 16 mm
Form Of Terminal: Ball
Output Function: Macrocell
Pitch Of Terminal: .8 mm
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
172 - -

Popular Products

Category Top Products