Xilinx - XCR3320-8BG256I

XCR3320-8BG256I by Xilinx

Image shown is a representation only.

Manufacturer Xilinx
Manufacturer's Part Number XCR3320-8BG256I
Description LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCR3320-8BG256I Datasheet
In Stock345
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 8.5 ns
Organization: 12 Dedicated Inputs, 3 I/O
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 2.55 mm
Sub-Category: Programmable Logic Devices
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 256
JTAG Boundary Scan Test: Yes
No. of I/O Lines: 3
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 95 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 27 mm
No. of Dedicated Inputs: 12
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: Loadable PLD
Maximum Supply Voltage: 3.6 V
Nominal Supply Voltage (V): 3.3
Technology Used: CMOS
JESD-609 Code: e0
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA256,20X20,50
Finishing Of Terminal Used: Tin Lead
Length: 27 mm
Form Of Terminal: Ball
In-System Programmable: Yes
Output Function: Macrocell
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
No. of Macro Cells: 320
Power Supplies (V): 3.3 V
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
345 - -

Popular Products

Category Top Products