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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCR3320-8BG256I |
Description | LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | XCR3320-8BG256I Datasheet |
In Stock | 345 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 3 V |
Package Body Material: | Plastic/Epoxy |
Propagation Delay: | 8.5 ns |
Organization: | 12 Dedicated Inputs, 3 I/O |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Seated Height: | 2.55 mm |
Sub-Category: | Programmable Logic Devices |
Surface Mount: | Yes |
Position Of Terminal: | Bottom |
No. of Terminals: | 256 |
JTAG Boundary Scan Test: | Yes |
No. of I/O Lines: | 3 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B256 |
Maximum Clock Frequency: | 95 MHz |
Package Shape: | Square |
Maximum Operating Temperature: | 85 °C (185 °F) |
Package Code: | BGA |
Width: | 27 mm |
No. of Dedicated Inputs: | 12 |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | Industrial |
Programmable IC Type: | Loadable PLD |
Maximum Supply Voltage: | 3.6 V |
Nominal Supply Voltage (V): | 3.3 |
Technology Used: | CMOS |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 °C (-40 °F) |
Qualification: | No |
Package Equivalence Code: | BGA256,20X20,50 |
Finishing Of Terminal Used: | Tin Lead |
Length: | 27 mm |
Form Of Terminal: | Ball |
In-System Programmable: | Yes |
Output Function: | Macrocell |
Pitch Of Terminal: | 1.27 mm |
Peak Reflow Temperature (C): | 225 °C (437 °F) |
No. of Macro Cells: | 320 |
Power Supplies (V): | 3.3 V |