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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCR3384XL-7.5CSG280I |
| Description | EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE; |
| Datasheet | XCR3384XL-7.5CSG280I Datasheet |
| In Stock | 603 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.7 V |
| Package Body Material: | Plastic/Epoxy |
| Propagation Delay: | 7.5 ns |
| Organization: | 216 I/O |
| Maximum Seated Height: | 1.2 mm |
| Surface Mount: | Yes |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 280 |
| No. of I/O Lines: | 216 |
| Package Style (Meter): | Grid Array, Thin Profile, Fine Pitch |
| JESD-30 Code: | S-PBGA-B280 |
| Package Shape: | Square |
| Maximum Operating Temperature: | 85 °C (185 °F) |
| Package Code: | TFBGA |
| Width: | 16 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Grading Of Temperature: | Industrial |
| Programmable IC Type: | EE PLD |
| Maximum Supply Voltage: | 3.6 V |
| Nominal Supply Voltage (V): | 3.3 |
| Technology Used: | CMOS |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 °C (-40 °F) |
| Qualification: | No |
| Finishing Of Terminal Used: | Tin Silver Copper |
| Length: | 16 mm |
| Form Of Terminal: | Ball |
| Output Function: | Macrocell |
| Pitch Of Terminal: | .8 mm |









