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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCR3384XL-7.5CSG280I |
Description | EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE; |
Datasheet | XCR3384XL-7.5CSG280I Datasheet |
In Stock | 172 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 2.7 V |
Package Body Material: | Plastic/Epoxy |
Propagation Delay: | 7.5 ns |
Organization: | 216 I/O |
Maximum Seated Height: | 1.2 mm |
Surface Mount: | Yes |
Position Of Terminal: | Bottom |
No. of Terminals: | 280 |
No. of I/O Lines: | 216 |
Package Style (Meter): | Grid Array, Thin Profile, Fine Pitch |
JESD-30 Code: | S-PBGA-B280 |
Package Shape: | Square |
Maximum Operating Temperature: | 85 °C (185 °F) |
Package Code: | TFBGA |
Width: | 16 mm |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | Industrial |
Programmable IC Type: | EE PLD |
Maximum Supply Voltage: | 3.6 V |
Nominal Supply Voltage (V): | 3.3 |
Technology Used: | CMOS |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 °C (-40 °F) |
Qualification: | No |
Finishing Of Terminal Used: | Tin Silver Copper |
Length: | 16 mm |
Form Of Terminal: | Ball |
Output Function: | Macrocell |
Pitch Of Terminal: | .8 mm |