Xilinx - XCS40XL-4BG256Q

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XCS40XL-4BG256Q by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCS40XL-4BG256Q
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCS40XL-4BG256Q Datasheet
In Stock308
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: Plastic/Epoxy
Organization: 784 CLBS, 13000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 1.1 ns
Maximum Seated Height: 2.55 mm
No. of Inputs: 224
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 224
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 13000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 217 MHz
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Automotive
Programmable IC Type: FPGA
Maximum Supply Voltage: 3.6 V
Nominal Supply Voltage (V): 3.3
Technology Used: CMOS
No. of Logic Cells: 784
No. of CLBs: 784
JESD-609 Code: e0
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA256,20X20,50
Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)
Length: 27 mm
Form Of Terminal: Ball
Additional Features: Maximum usable gates = 40000
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 3.3 V
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