Xilinx - XCS40XL-4BGG256C

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XCS40XL-4BGG256C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCS40XL-4BGG256C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCS40XL-4BGG256C Datasheet
In Stock475
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: Plastic/Epoxy
Organization: 784 CLBS, 13000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 1.1 ns
Maximum Seated Height: 2.55 mm
No. of Inputs: 205
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 205
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 13000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 217 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 3.6 V
Nominal Supply Voltage (V): 3.3
Technology Used: CMOS
No. of Logic Cells: 1862
No. of CLBs: 784
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA256,20X20,50
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 27 mm
Form Of Terminal: Ball
Additional Features: Maximum usable gates 40000
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
Power Supplies (V): 3.3 V
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