Xilinx - XCS600E-7FG676C

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XCS600E-7FG676C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCS600E-7FG676C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCS600E-7FG676C Datasheet
In Stock476
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.42 ns
No. of Inputs: 514
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 514
Position Of Terminal: Bottom
No. of Terminals: 676
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B676
Maximum Clock Frequency: 400 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
No. of Logic Cells: 15552
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA676,26X26,40
Finishing Of Terminal Used: Tin Lead
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 1.8,2.5,3.3 V
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