Xilinx - XCV100-4CSG144C

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XCV100-4CSG144C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCV100-4CSG144C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet XCV100-4CSG144C Datasheet
In Stock406
NAME DESCRIPTION
Minimum Supply Voltage: 2.375 V
Package Body Material: Plastic/Epoxy
Organization: 600 CLBS, 108904 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.8 ns
Maximum Seated Height: 1.2 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 144
No. of Equivalent Gates: 108904
Package Style (Meter): Grid Array, Thin Profile, Fine Pitch
JESD-30 Code: S-PBGA-B144
Maximum Clock Frequency: 250 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: TFBGA
Width: 12 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 2.625 V
Nominal Supply Voltage (V): 2.5
Technology Used: CMOS
No. of CLBs: 600
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 12 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
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